In daily life, people's reliance on electronic equipment is becoming more and more serious. The replacement of electronic technology also means that people have high hopes for the technical development of power supply. The following is a brief introduction to the main classification of power management technology.
Power management semiconductors clearly emphasize the location and role of power management integrated circuits (power management ICs, referred to as power management chips) from the included devices. The power management semiconductor consists of two parts, a power management integrated circuit and a power management discrete semiconductor device.
Power management ICs come in many categories and are roughly divided into voltage regulation and interface circuits. The voltage eliminator includes a linear low-dropout regulator (LDO), and a series of positive and negative output circuits, as well as a pulse-width modulation (PWM) type switching circuit. Due to technological advances, the physical size of digital circuits in integrated circuit chips is getting smaller and smaller, and thus the working power supply is developing toward low voltage, and a series of new voltage regulators have emerged. Interface circuits for power management mainly include interface drivers, motor drivers, power field effect transistor (MOSFET) drivers, and high voltage/high current display drivers.
Power Management Discrete semiconductor devices include some traditional power semiconductor devices, which can be divided into two categories, one containing rectifiers and thyristors; the other is triode type, including power bipolar transistors, containing MOS structures. Power field effect transistors (MOSFETs) and insulated gate bipolar transistors (IGBTs).
To a certain extent, it is precisely because of the massive development of power management ICs that power semiconductors have been renamed as power management semiconductors. It is precisely because so many integrated circuits (ICs) enter the power supply field that people are more often referred to as power management at this stage.
The main part of the power management semiconductor is the power management IC, which can be roughly classified into the following eight types.
1. AC/DC modulation IC. It contains a low voltage control circuit and a high voltage switching transistor.
2. DC/DC modulation IC. Includes boost/buck regulators, as well as charge pumps.
3. Power factor control PFC pre-modulation IC. A power input circuit with power factor correction is provided.
4. Pulse modulation or pulse amplitude modulation PWM / PFM control IC. It is a pulse frequency modulation and/or pulse width modulation controller for driving an external switch.
5, linear modulation IC (such as linear low-dropout regulator LDO, etc.). Includes forward and negative regulators, as well as low dropout LDO modulation tubes.
6, battery charging and management IC. Including battery charging, protection and power display ICs, as well as battery data communication "smart" battery IC.
7. Hot-board control IC (except for the effect of inserting or removing another interface from the working system).
8, MOSFET or IGBT switching function ic.
Among these power management ICs, voltage regulation ICs are the fastest growing and most productive part. Various power management ICs are basically associated with some related applications, so more types of devices can be listed for different applications.
The technical trend of power management is high efficiency, low power consumption, and intelligence.
Improving performance involves two different aspects: on the one hand, it wants to maintain the overall efficiency of energy conversion, and also wants to reduce the size of the device; on the other hand, it protects the size and greatly improves the performance.
In AC/DC conversion, low on-state resistance meets the need for more efficient adapters and power supplies in computer and telecom applications. In terms of power circuit design, the general standby energy consumption has dropped below 1W, and the power efficiency can be increased to more than 90%. To further reduce existing standby power consumption, new IC manufacturing process technologies and breakthroughs in low-power circuit design are needed.
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