New Manufacturing Process: 28nm HPP

GlobalFoundries announced at its own global technology conference that the 28nm manufacturing process will add a new high-performance version of "28nm HPP" (High-Performance Plus).

GF explained that compared with a typical 28nm HP process, 28nm HPP can improve chip performance by about 10%, support operating frequencies above 2GHz, mainly for smart mobile devices and high-performance processors, and at the same time can choose ultra-low leakage rate transistors And SRAM cell, expand its application area from high performance to low power consumption.

In addition, GF will also provide rich RF CMOS technology, making the 28nm HPP an ideal platform for the next-generation high-performance SoC system-on-chip design. Both high-performance and low-power devices have a wide range of application prospects.

GF claims that if customers have designed high-performance chips based on the 28nm HP process, they can use the new 28nm HPP process later in the product lifecycle to design a higher-performance upgrade to update the product line without having to completely redesign the entire chip. This is in line with the replacement strategy of Radeon HD 6000/5000 series.

In addition to the two high-performance versions, the GF 28nm process has an ultra-low-power version of the 28nm SLP for mobile and consumer electronics devices that are very power sensitive. All three versions use HKMG and Gate First technology.

GF plans to begin trials of the 28nm HPP process in the fourth quarter of 2011 and is expected to become a secret weapon for AMD's new architectural graphics in the future.

GF also announced the 22/20nm process roadmap: The company plans to provide test chips in the second half of 2011, start risky trial production in the second half of 2012, and officially start production for customers in 2013. The 20nm process will have two versions of HP's high-performance, SLP ultra-low power consumption, and the 22nm process will focus on Ultra High Performance (SHP).

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