Rapidly heating the ceramic substrate into the outbreak

[Text / high-tech LED Xu Chaopeng] With the rapid development of the LED industry, the integration of high-power density products is becoming market-oriented, and the ceramic substrate industry is also heating up rapidly.

Since the first half of last year, a number of investment projects for the industrialization of ceramic substrates have been released throughout the country. Since the beginning of 16 years, this trend has also intensified. It can be seen that the overall expectation of the industry in this industry is very high. Once the product becomes the new favorite of the industry, it will undoubtedly achieve a blue ocean market.

"At present, LED heat-dissipating substrates on the market have two kinds of metal and ceramic substrates. Among them, LED products use metal substrates, which still occupy the majority, because the materials of metal substrates are mainly aluminum or copper, the cost is low, and the technology is relatively mature. It is a circuit board based on highly efficient heat-dissipating and chemically stable ceramic materials, especially suitable for high-power electronic component packaging applications.” Wang Gang, director of sales of Jingpin New Materials, told the reporter.

Wang Gang introduced that in the case that the thermal conductivity and insulation of existing aluminum substrates are difficult to meet the requirements of high-power products, the existing high-thermal ceramic circuit boards can meet such design requirements, and ceramics and metals are compared with heat, due to new The heat conductive material and the new internal structure thereby eliminating various defects of the aluminum metal substrate, thereby greatly improving the overall heat dissipation effect of the substrate.

It is reported that the current ceramic substrate refers to a special process board for directly bonding copper foil to the surface of aluminum nitride (ALN) or alumina (AL2O3) ceramic substrate (single or double sided) at high temperature. The ultra-thin composite substrate produced by this process has excellent electrical insulation properties, high thermal conductivity, high adhesion strength and excellent solderability, and can etch various patterns and have strong current carrying capacity. ability.

At the same time, the current ceramic substrate has become the basic material of interconnect technology and high-power power electronic circuit structure, and is gradually replacing the aluminum substrate. International companies including Cree, Osram, Philips and Nichia have also used ceramic substrates as the heat dissipation material for LED chips.

"With the advent of ceramic substrate products, the development of the heat dissipation application industry will be opened. Due to the heat dissipation characteristics of the ceramic substrate, and the ceramic substrate has the advantages of high heat dissipation, low thermal resistance, long life, and withstand voltage, with the improvement of production technology and equipment. The product price is accelerated and rationalized, and the application fields of the LED industry, such as the indicator lights of home appliances, car lights, street lamps, etc., are expanded." Wang Gang said.

Regardless of industry trends or technology research and development, the ceramic substrate industry has reached an explosive period. High heat dissipation, low thermal resistance, long life, and withstand voltage, the outstanding advantages of the product will enable it to occupy the market faster, thus giving back to the industry fermentation, increasing capital inflows and social concerns. The successful development of ceramic substrates will provide more assistance for indoor lighting and outdoor lighting products, making the LED industry's future market more broad.

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