It is well known that the luminescent properties of LEDs are highly dependent on their operating conditions. The forward current applied to the LED is the main influencing factor, and the higher the current, the more luminous flux the LED produces. Unfortunately, the LED is driven by a constant current source, and as the temperature of the LED rises, its light output drops dramatically. Figure 1 shows the effect of common LED basic parameters on the output spectrum. In addition, this figure also shows that the efficiency of the LED and the color of the luminescence also shift at the peak wavelength.
Figure 1: Effect of current and temperature on the red LED output spectrum (click on image to enlarge)
The importance of LED thermal characteristics
Since the light output of an LED changes with temperature, good thermal management is an important issue in power LED lighting applications. By lowering the temperature of the LED, we can maintain it at a higher efficiency. In practical applications, the lower the LED temperature, the more lumens it outputs.
This means that in the actual application of LED, its true thermal resistance from junction to environment is an important factor in LED lighting design . It is regrettable that the thermal resistance and other temperature-related characteristic parameters offered by different LED suppliers are varied. Therefore, different thermal standards agencies have also begun to work on the development of standards for LED thermal management. Today, the JEDEC JC15 Association is drafting a new standard for LED thermal resistance measurements. In addition, the International Lighting Committee has established two new technology associations (TC-2-63 and TC-2-64) to address LED thermal issues. There is a growing consensus among these associations that suppliers must consider the actual optical power Popt (in other words, the radiant flux) when calculating the LED thermal resistance using Equation 1:
The product of the LED forward current and the forward voltage (IFxVF) in the equation is the electrical power required for LED operation, and ΔTj is the junction temperature variation of the LED.
6 Layer PCB - stackup & prototype & price & manufacturing
What is 6 layer PCB?
6 layer PCB Board is, in general, a 4 Layer PCB Board with 2 extra signal layers added between the planes. The 6-layer PCB classic stackup includes 4 routing layers (2 outer layers + 2 internal layers) and 2 internal planes (one for ground and the other for power). This enhances the EMI dramatically by offering 2 buried layers for high-speed signals and 2 surface layers for routing low-speed signals. The signal layers should be closed to the adjacent planes.
6 Layer PCB Stackup and Design
What is PCB stack UP?
PCB Stack up refers to the arrangement of copper and insulation layers that make up PCB before the layout design of circuit board. Although stacking allows you to get more circuits on a single board through various PCB layers, the structure of PCB stacking design has many other advantages:- The PCB layer stack can help you minimize circuit noise and radiation and reduce impedance and crosstalk problems in high-speed PCB layouts.
- A good stacked PCB stack can also help you balance the need for low-cost, efficient manufacturing methods and focus on signal integrity issues.
- Proper PCB stacking can enhance the electromagnetic compatibility of your design.
- For PCB-based applications, stacked PCB configurations are usually good for you.
Why do PCBs stack up?
The irreversible development of modern electronic products has increasingly pushed PCB towards such needs as miniaturization, light weight, high speed, better functionality and reliability, and longer life, which has led to the popularity of multi-layer PCB. Two or more Single Sided PCB and/or Double Sided PCB are stacked together by a combination of semi-solid adhesives called "prepregs" to form multilayer PCBs through reliable predefined interconnections between them. There are three or more conductive layers in a Multilayer PCB , two of which are outside, and one is synthesized in an insulating board. With the increasing complexity and density of PCB, some problems may arise, such as noise.
One of the most important factors to determine the performance of product electromagnetic compatibility (EMC) is to plan the optimal multi-layer stack up. The carefully designed cascade can minimize radiation and prevent the circuit from being disturbed by external noise sources. Good stacked PCB substrates can also reduce signal crosstalk and impedance mismatch. However, poorer stacking may increase EMI radiation, because impedance mismatch will lead to reflection and ringing in the system, which will greatly reduce the performance and reliability of the product. Then, this article will focus on the layer stack definition, design rules and basic considerations.
Most six-layer PCB consist of four signal routing layers and two planes. From an EMC perspective, a 6-layer Printed Circuit Board is usually better than a 4 Layer PCB board.
6 Layer PCB stackup
6 layer 1.6 MM standard stackup and thickness
Fig. 1 One of the stackup methods of 6-layer PCB
With six layers available the principle of providing two buried layers for high-speed signals is easily implemented as shown in Fig. 2. This configuration also provides two surface layers for routing low speed signals.
Fig. 2 Less common 6 layer PCB stackup
Not nearly as common, but a good performing stack-up for a six-layer PCB is shown in Fig. 2.
Fig. 3 Another performing six-layer PCB board stackup
Another excellent performing six-layer PCB board stackup is shown in Fig. 4. It provides two buried signal layers and adjacent power and ground planes and satisfies all five objectives. The big disadvantage, however, is that it only has two routing layers -- so it is not often used.
Fig. 4 Another excellent performing six-layer PCB board stackup
6 Layer PCB Stackup for EMI/EMC
EMI/EMC Return Current 6 Layer PCB Issue
EMI/EMC Return Current 6 Layer PCB Solved
Types of 6 PCB stack up-how to choose?
PCB materials and stackup thickness commonly used in multilayer circuit boards.
| 6 Layer Stackup - 0.8mm thickness | ||||||
| layer order | layer name | material type | material description | dielectric constant | thickness | copper weight |
| 1 | top | copper | signal | 0.035mm | 1 oz | |
| 2116 | prepreg | 4.5 | 0.12mm | |||
| 2 | inner 1 | copper | plane | 1 oz | ||
| core | 4.6 | 0.2mm | ||||
| 3 | inner 2 | copper | plane | 1 oz | ||
| 2116 | prepreg | 4.5 | 0.12mm | |||
| 4 | inner 3 | copper | plane | 1 oz | ||
| core | 4.6 | 0.2mm | ||||
| 5 | inner 4 | copper | plane | 1 oz | ||
| 2116 | prepreg | 4.2 | 0.12mm | |||
| 6 | bottom | copper | signal | 0.035mm | 1 oz | |
| Final board thickness: 0.8mm±0.1mm | ||||||
| 6 Layer Stackup - 1.0mm thickness | ||||||
| layer order | layer name | material type | material description | dielectric constant | thickness | copper weight |
| 1 | top | copper | signal | 0.035mm | 1 oz | |
| 2116 | prepreg | 4.5 | 0.12mm | |||
| 2 | inner 1 | copper | plane | 1 oz | ||
| core | 4.6 | 0.3mm | ||||
| 3 | inner 2 | copper | plane | 1 oz | ||
| 2116 | prepreg | 4.5 | 0.12mm | |||
| 4 | inner 3 | copper | plane | 1 oz | ||
| core | 4.6 | 0.3mm | ||||
| 5 | inner 4 | copper | plane | 1 oz | ||
| 2116 | prepreg | 4.2 | 0.12mm | |||
| 6 | bottom | copper | signal | 0.035mm | 1 oz | |
| Final board thickness: 1.0mm±0.1mm | ||||||
| 6 Layer Stackup - 1.6mm thickness (preferred materials) | ||||||
| layer order | layer name | material type | material description | dielectric constant | thickness | copper weight |
| 1 | top | copper | signal | 0.035mm | 1 oz | |
| 2116 | prepreg | 4.5 | 0.12mm | |||
| 2 | inner 1 | copper | plane | 1 oz | ||
| core | 4.6 | 0.6mm | ||||
| 3 | inner 2 | copper | plane | 1 oz | ||
| 2116 | prepreg | 4.5 | 0.12mm | |||
| 4 | inner 3 | copper | plane | 1 oz | ||
| core | 4.6 | 0.6mm | ||||
| 5 | inner 4 | copper | plane | 1 oz | ||
| 2116 | prepreg | 4.2 | 0.12mm | |||
| 6 | bottom | copper | signal | 0.035mm | 1 oz | |
| Final board thickness: 1.6mm±0.1mm | ||||||
| 6 Layer Stackup - 1.6mm thickness (non-preferred materials but possible) | ||||||
| layer order | layer name | material type | material description | dielectric constant | thickness | copper weight |
| 1 | top | copper | signal | 0.035mm | 1 oz | |
| 2116 | prepreg | 4.7 | 0.2mm | |||
| 2 | inner 1 | copper | plane | 1 oz | ||
| core | 4.6 | 0.5mm | ||||
| 3 | inner 2 | copper | plane | 1 oz | ||
| 2116 | prepreg | 4.5 | 0.12mm | |||
| 4 | inner 3 | copper | plane | 1 oz | ||
| core | 4.6 | 0.6mm | ||||
| 5 | inner 4 | copper | plane | 1 oz | ||
| 2116 | prepreg | 4.7 | 0.2mm | |||
| 6 | bottom | copper | signal | 0.035mm | 1 oz | |
| Final board thickness: 1.6mm±0.1mm | ||||||
| 6 Layer Stackup - 2.0mm thickness (preferred materials) | ||||||
| layer order | layer name | material type | material description | dielectric constant | thickness | copper weight |
| 1 | top | copper | signal | 0.035mm | 1 oz | |
| 7630 | prepreg | 4.7 | 0.2mm | |||
| 2 | inner 1 | copper | plane | 1 oz | ||
| core | 4.6 | 0.6mm | ||||
| 3 | inner 2 | copper | plane | 1 oz | ||
| 7630 | prepreg | 4.7 | 0.2mm | |||
| 4 | inner 3 | copper | plane | 1 oz | ||
| core | 4.6 | 0.6mm | ||||
| 5 | inner 4 | copper | plane | 1 oz | ||
| 7630 | prepreg | 4.7 | 0.2mm | |||
| 6 | bottom | copper | signal | 0.035mm | 1 oz | |
| Final board thickness: 2.0mm±0.2mm | ||||||
6
Layer Stackup - 2.0mm thickness (non-preferred materials but possible)
layer order
layer name
material type
material description
dielectric constant
thickness
copper weight
1
top
copper
signal
0.035mm
1 oz
2116+7628
prepreg
4.7+4.7
0.12mm+0.185mm
2
inner 1
copper
plane
1 oz
core
4.6
0.6mm
3
inner 2
copper
plane
1 oz
2116
prepreg
4.7
0.12mm
4
inner 3
copper
plane
1 oz
core
4.6
0.6mm
5
inner 4
copper
plane
1 oz
2116+7628
prepreg
4.7+4.7
0.12mm+0.185mm
6
bottom
copper
signal
0.035mm
1 oz
Final board
thickness: 2.0mm±0.2mm
6 Layer PCB Quote and Price
6 L ayer PCB Prototype Price
Of course, at the same time, we also provide sample production services for other PCB products to verify your design as soon as possible.
With regard to delivery, we can provide 24-hour, 72-hour urgent service. No matter where you are in the world.
6 Layer PCB Manufacturing
- Manufacturable PCB Layers
We have abundant experience in manufacturing multi-layer circuit boards, not only in the production process, but also have many years of professional PCB engineers.So if you have multilayer PCB to produce, no matter how many layers, just let us know.
- What size of 6-layer circuit boards can you produce?
According to our PCB manufacturing capability, we have no size limitation.
- PCB Laminate Types
We offer a variety of PCB laminates ranging from FR4 130Tg for lower heating temperatures up to FR4 180Tg for higher temperatures. Also offered are Polyimide, Taconic, Rogers and Nelco material types.
- Manufacturable Thickness of 6-Layer Circuit Board
As with the number of PCB layers we can manufacture, we still have no restrictions on the thickness of the six-layer PCB and can manufacture it.
- PCB Surface Finish Types
We offer various PCB finishes including HASL (Solder), ENIG, Immersion Silver, Immersion Tin, Hard Gold, Entek/OSP, Unclad, Pb Free HASL, Selective Gold and ENEPIG.
Why order 6 layer PCB from JHY PCB?
You will get it after check below advantages.
1. Good quality and price: We are experienced in producing six layer PCB, cost and time can be controlled well. This can help our customer to order good boards in cost-effective price.
2. Short Turnaround Times:
3. No Minimum Quantity: 1 pcs of PCB can be offered.
4. More orders, more discount.
5. Custom PCB Sizes
6 Layer PCB
Printed Circuit Boards,6 Layer PCB,6 Layer PCB Price,6 Layer PCB Prototype
JingHongYi PCB (HK) Co., Limited , https://www.pcbjhy.com