The TDK Group has recently launched a groundbreaking ultra-thin ceramic substrate called **CeraPadâ„¢**, designed with a multi-layer structure that integrates ESD protection, eliminating the need for separate ESD components. This innovative solution is ideal for applications requiring extreme miniaturization and offers superior ESD protection, making it perfect for sensitive electronic systems.
CeraPad ceramic substrates provide up to **25kV of ESD protection**, which is three times higher than conventional Zener diodes that typically offer only 8kV. In addition, CeraPad boasts a thermal conductivity of up to **22 W/mK**, which is also three times better than traditional substrates. The ultra-thin design, ranging from **300 to 400 micrometers**, makes it highly suitable for advanced packaging needs.
Custom contact pads can be tailored according to soldering process requirements, supporting both standard SAC (Sn/Ag/Cu, 260°C) reflow and eutectic solder (AuSn, 320°C) processes. This flexibility ensures compatibility with a wide range of manufacturing techniques.
With the growing number and density of LEDs, CeraPad is especially well-suited for various LED applications. It enables the reduction of standard LED component custom chip packages (CSP) from CSP1515 to CSP0707. Moreover, its low coefficient of thermal expansion—**6 ppm/mK**—matches closely with that of LEDs, minimizing mechanical stress during temperature fluctuations.
Like PCBs, CeraPad’s multi-layer technology allows for the integration of certain ICs through internal layer redistribution. While current matrix LEDs often use multiple dual LEDs in series, CeraPad opens the door to a new type of LED array where hundreds of individual LED sources can be independently controlled. This innovation gives designers the freedom to create high-resolution, secure lighting effects in compact spaces, such as multi-LED flashlights on smartphones or adaptive automotive headlights.
By offering CeraPad ceramic substrates, the TDK Group provides an attractive custom packaging solution that helps customers meet the rising demands of future IC sensitivities. This technology not only enhances lighting design possibilities but also improves LED efficiency.
**Main Applications**
- LED systems for car headlights and smartphone flashlights
- Car ECU, smartphones, and tablets
**Key Features and Benefits**
- Integrated ESD protection within the multi-layer substrate
- ESD protection capability up to 25kV
- Thermal conductivity up to 22 W/mK
- Ultra-thin thickness: 300–400 μm
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