TDK launches CeraPad? Ultra-thin substrate with integrated ESD protection

LED light-emitting diode

ESD TVS electrostatic protection tube 0201 package 3.3V ultra low capacitance ESD

The TDK Group has launched a groundbreaking innovation in the field of ceramic substrates: CeraPadTM. This ultra-thin, multi-layer ceramic substrate integrates ESD (Electrostatic Discharge) protection directly into its structure, eliminating the need for additional ESD components. Designed for extreme miniaturization, CeraPad offers superior ESD protection, making it ideal for sensitive electronic applications where space is at a premium.

One of the standout features of CeraPad is its impressive ESD protection capability, which reaches up to 25kV—significantly outperforming traditional Zener diodes that typically offer only 8kV. This means CeraPad provides up to three times better ESD protection than conventional solutions. In addition, the ceramic substrate boasts a thermal conductivity of up to 22 W/mK, three times higher than that of standard carriers. Its ultra-thin profile, ranging from 300 to 400 micrometers, makes it highly suitable for advanced packaging needs.

CeraPad’s contact pads can be customized according to specific welding process requirements, supporting both standard SAC (Sn/Ag/Cu, 260°C) reflow and eutectic solder (AuSn, 320°C) processes. This flexibility ensures compatibility with a wide range of manufacturing techniques, offering manufacturers greater design freedom and reliability.

With the growing complexity and density of LEDs, CeraPad is particularly well-suited for next-generation LED applications. It allows for a significant reduction in the size of standard LED component custom chip packages (CSP), from CSP1515 down to CSP0707. The material also features a very low coefficient of thermal expansion (6 ppm/mK), closely matching that of LEDs. This ensures minimal mechanical stress between the substrate and the LED during temperature fluctuations, enhancing long-term performance and durability.

Like PCBs, CeraPad's multi-layer technology enables the integration of certain circuits through internal layer redistribution. Modern matrix LEDs often consist of multiple dual LEDs in series, but CeraPad opens the door to a new type of LED array where hundreds of individual LED sources can be independently controlled. This breakthrough empowers designers to create high-resolution, secure lighting effects in compact spaces—such as multi-LED flashlights in smartphones or adaptive headlights in vehicles.

By introducing CeraPad ceramic substrates, the TDK Group is providing customers with a powerful custom packaging solution that addresses the increasing sensitivity of modern ICs. This innovative approach not only enhances lighting design possibilities but also improves overall LED efficiency, helping customers stay ahead in the evolving electronics landscape.

Main Applications:

• LED systems for car headlights and smartphone flash
• Car ECU, smartphones, and tablets

Main Features and Advantages:

• Integrated ESD protection in a multi-layer substrate
• ESD protection capability up to 25kV
• Thermal conductivity up to 22 W/mK
• Ultra-thin thickness from 300μm to 400μm