The well-known Japanese semiconductor manufacturer **ROHM** (based in Kyoto, Japan) has recently started mass production of the world's smallest transistor package, the **VML0806**, designed for compact and lightweight electronic devices like smartphones and digital cameras. This new package measures just **0.8mm × 0.6mm** with a height of **0.36mm**, marking a significant step forward in miniaturization.
The VML0806 is already available for sampling at a price of **80 yen per unit**, and it has been in full-scale production since July, with a monthly output of **60 million units**. To meet growing demand, ROHM plans to further expand its manufacturing capacity in the future. The production facilities are located at **ROHM-Wako Electronics (Malaysia) Sdn. Bhd.** and **ROHM Integrated Systems (Thailand) Co., Ltd.**
In recent years, the portable device market—especially smartphones—has seen rapid advancements in both miniaturization and performance. As a result, there’s increasing pressure on component manufacturers to make their products smaller, thinner, and more efficient. However, traditional transistor packages have faced challenges such as limited miniaturization of internal components, instability in crystal structures, and difficulties in achieving high-precision packaging. The previous limit was the **1006 size (1.0mm × 0.6mm, 0.37mm height)**, which was considered the smallest possible.
Through advanced component design and high-precision packaging technology, ROHM has successfully developed the **VML0806**, the world's smallest transistor package. The package has also been optimized for better mounting performance and mass production, making it ideal for next-generation electronics.
This new package is first being used in **small signal MOSFETs**. Compared to the **1212 package (1.2mm × 1.2mm, 0.50mm height)**, the VML0806 reduces the mounting area by **67%** and the thickness by **28%**, while maintaining the same level of basic performance. Looking ahead, ROHM plans to expand the use of this package to a wider range of applications, including **bipolar transistors and digital transistors**, helping to save space and increase component density in various devices.
Key features of the VML0806 include:
1. **Smallest size** – Reduces installation area by 67% compared to the 1212 package.
2. **High-density back-side pins** – Improves mounting efficiency.
3. **Low on-resistance** – Achieves **2.6Ω** in the world’s smallest size.
These innovations position the VML0806 as a game-changer for the future of compact, high-performance electronics.
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