Thanks to a broader network, continuous optimization of technology and commercial access, and more investment in the Internet of Things (IoT), the pace of IoT commercialization is taking off. According to market research organizations, the global Internet of Things market will reach 11 trillion yuan in 2020, and China's market will exceed one trillion yuan. The wave of Internet of Things is sweeping. As the core device of the IoT awareness layer, transport layer and application layer, the market is also rising. It is predicted that the global IoT chip market compound growth rate will reach 11.5% in 2016-2022, and the 2022 global IoT chip market will exceed 10 billion US dollars. Along with the advancement of the Internet of Things, the chip has shifted from performance-oriented to application-oriented. The demand for single devices has shifted to the demand for platform solutions. The diversified market has also proposed more customized and differentiated requirements for chips. How IC companies are based on user and application requirements. Technical integration and customized optimization have become new challenges.
IoT moves towards smart + era
IoT has spawned countless potential applications, including wearables, smart homes, smart cars, smart medical, and industrial 4.0. It is true that the Internet of Things is a diversified but still fragmented market, facing the challenges of non-uniform standards, improved security, immature business models, and more intelligent hardware. But this is a must for any emerging industry. "Surprising", through continuous and even slow iterations, as well as the continuous testing and exploration of leading manufacturers, these challenges are expected to be solved one by one in the process of baptism.
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Recently, the good news about the Internet of Things has been continuously, and the authorities at the first global 5G conference jointly sponsored by China, the European Union, Japan, South Korea and the Americas 5G promotion organization recently said that China will launch 5G commercial and 5G continuous in 2020. In the four scenarios of wide-area coverage, hotspot high-capacity, low-power large connection and low latency and high reliability, the latter two are mainly connected to the Internet of Things. Recently, the NB-IoT (Narrowband Cellular Internet of Things) standard has been approved by the international organization 3GPP, and the establishment of the NB-IoT standard is not only a major breakthrough in the transmission layer, but also detonates the development of the upstream and downstream, and the industrial chain is fully erupted.
With the decline in hardware costs, the combination of cloud computing big data and industry, and the advancement of 5G and NB-IOT technologies, the factors driving ecological development have gradually matured. Moreover, after the artificial intelligence technology reached a certain level, the Internet of Things began to usher in the "smart +" era. The Internet of Things will reach new heights in terms of application experience and popularity, and will create smarter economic development models and ecosystems with smarter machines, smarter networks, and smarter interactions.
Therefore, the common force of internal and external factors and the guidance of the intelligent era have triggered the "core" requirements of the Internet of Things application. Not only the improvement of the capabilities of a single chip, but also the need to provide integrated technology solutions including chips, reference designs, system layers (SDK), etc., while also supporting cloud services for customers, which is "innovation at the chip level". "The upgrade of software platforms and vertical industry applications has put forward new propositions. What is important is how to "smart" to meet difficulties.
Multiple challenges for APs
The main chip of the Internet of Things is naturally the responsibility of “servingâ€. With the deepening and upgrading of IoT applications, the application processor (AP) has become a new “net redâ€.
Although in relatively simple applications, IoT chips are mostly MCU "plus" wireless connectivity modules, such as WiFi/Bluetooth/ZigBee communication modules, running RTOS operating systems or simple applications. But in addition to simple network connections, the IoT smart trend will involve more content and services, such as video analysis in intelligent video surveillance, data model algorithms for smart washing machines, not only for chip local computing, storage and data processing capabilities. To propose new requirements, we also need to support a diversified operating system, while paying attention to differentiated applications, AP will also be popular.
In order to succeed in the Internet of Things market, the requirements for APs are completely different from those of previous industries. It requires both “18 martial arts†and “local conditionsâ€, that is, APs need to be applied to package size, computing power and peripherals. Customization and optimization in many aspects, such as integration, with better scalability and ease of development.
"Summarizing the needs of different IoT application platforms, IC vendors need to provide ultra-low power consumption, connect and process multiple sensor data, support multiple wireless connection technologies, support multimedia processing, support multiple operating systems, and target applications. A specially optimized AP and a complete development platform,†concluded Amy Wong, product director at Marvell IoT.
Marvell IAP220 Sensor Fusion Demo
Tailored AP solution
In such a fragmented and differentiated market, AP is required to be "to the vast and subtle". Marvell, who has been deeply involved in the Internet of Things industry for many years, has launched a new, tailor-made IAP series of APs, which has also undergone different “cutting†on a multi-dimensional level.
The Marvell IAP family includes the IAP 140 with the Cortex A53 core and the IAP220 with the dual-core Cortex A7 core. The IAP series platform is optimized for smart homes, providing computing power and multimedia processing capabilities to enhance customer experience, comfort and security. For wearable device platforms, IAP provides a fusion of ultra-low power architecture and sensors for real-time data processing. For industrial IoT applications, a library of sensor hubs or sensors, equipped with Kinoma architecture, Android and generic architecture, allows customers to customize development.
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