LED chip packaging technology three major genre analysis

LED competition will be technical competition in the past two years, but it is inseparable from two laws: “Technology is getting more and more advanced”, especially the improvement of light efficiency; “The cost will be lower and lower”, especially in the chip. According to the first LED network, the cost of packaging and power supply is reduced, and of course, how the lamps can be assembled automatically, reducing labor costs.
In the LED industry, it has been almost 16 years, witnessing a blue chip from five yuan (1998) to the current one thousand five dollars (5 RMB / k), the industry is progressing too fast, even more than The IC is still fast, I have witnessed its growth, and I have participated in his progress. Now, for the past ten years, my experience with LED technology has been shared with you, especially in the middle and upper reaches of the technology.
The genre of GaN LED technology is divided into three parts:
The first is the vertical structure, represented by Cree and Osram, Xu Ming of the metal substrate, and Puri Toshiba and Crystal Energy, which are attached to the silicon substrate. Of course, we must not forget that many Japanese manufacturers and Mr. Nakamura are developing. The GaN homogenous structure.
The second is the flip chip. It is of course Philips Luminled. Of course, China’s Jingke and many Taiwanese chip factories are developing such chips. Even Cree is starting to make such products. So technology and yield are also constantly maturing.
The third is of course the sapphire substrate structure. At present, almost every company has made great improvements based on this structure. The previous 16 years of progress has been a thousand times, which has been continuously improved with this structure.
Each of the three major schools has its own advantages and disadvantages, which are described as follows:
Vertical structure pie:
A bit like the feeling of Mingjiao or the sun and the moon, it is not the mainstream, but it has unique technology. If it is the ultimate, it can be like the sharp silicon carbide technology can still compete with the mainstream, in Jin Yong's novels, whether it is Yangdingtian Zhang Wuji, I am still undefeated in the East, they can fight against Shaolin Wudang, but it is not mainstream or disappears like a meteor.
This is the case with the vertical structure, which is always on the non-mainstream route, and new technologies have been published, but it is still difficult to find them in the market.
In addition to silicon carbide and homogenous substrates, the vertical structure requires a very complicated process to manufacture. Whether it is a silicon substrate or a metal substrate, the problem of thermal mismatch with gallium nitride has not been solved, resulting in a very low yield of this structure. Although the heat conduction is good, the substrate is cheaper than the sapphire, and the light-emitting area is relatively large, but it is not an opponent of the sapphire structure in terms of cost and technology competition.
Because of the upper and lower electrodes, it is also limited in application. Especially in the circuit design that requires serial connection, it can not meet the requirements of many lamps, and can not make high-voltage chips. Therefore, Cree's vertical structure chips can only be used in street lamps. In the high-priced specific market, the vertical structure chips of the two mainstream markets, general illumination and backlight, have not been able to intervene in a large amount.
Of course, we can't ignore the homogenous structure that the Japanese company and Mr. Nakamura Shuji are developing. It has no shortcomings mentioned above, but a fatal problem is enough to defeat all its advantages. The gallium nitride substrate is expensive, two years ago. It’s $1,000, and now it’s more than $500. Is it too extravagant to do LEDs? Therefore, the homogenous substrate can only be used as a blue laser diode for the HD-DVD player or the high-quality PS3 game console.
Everyone will ask if I have any room for price cuts? My answer is "Yes, but limited". At present, there are only two mainstream practices for GaN substrates. The hydride vapor phase epitaxy HVPE and the thermal ammonia method amonothermal method are estimated to be competitive to 100 US dollars, but according to the current The technology is not up to five years.

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