High-end process equipment independent innovation

High-end process equipment independent innovation
Ji Ankuan, Vice President of Marketing of Beijing North Microelectronics Co., Ltd. will deliver a speech at the "7th China LED Industry Health Development Summit Forum": Lighting has become the most important driving force in the LED terminal application market. The demand for LED lighting market will increase in the next few years. Will accelerate. The continuous increase in the penetration rate of LED lighting has not only stimulated the development of the entire industry, but also put forward higher requirements for new technologies and new processes. The LED chips and packaging technologies including flip-chip, high-voltage chips, wafer-level packaging, and AlN buffer layers are emerging technologies emerging to meet the needs of future high-brightness, low-cost chip manufacturing processes. The equipment manufacturers, through independent development and working with customers, provided Etch and Sputter equipment and process solutions for implementing these advanced processes.
On April 11th, the China LED Industry Health Development Summit Forum will be held in Shenzhen Wuzhou Hotel, under the guidance of Electronics and Information Department of the Ministry of Industry and Information Technology and Consumer Products Industry Division. China Semiconductor Lighting/LED Industry and Application Alliance and China Electronic Equipment Corporation The joint sponsorship is an important part of the "Second China Electronic Information Expo" held during the same period. China Electronic Information Expo embodies the latest developments in the field of electronic information in China. It is an information gathering platform for electronic information industry, a display platform for achievements, and a platform for the exchange of the latest technologies. The China LED Industry Health Development Summit Forum will continue to fully display China's semiconductor lighting. /LED industry development lineup strength, technical level and technological innovation.
The previous six forums were strongly supported and widely recognized by the industry. In response to the needs and hopes of the majority of people in the industry, the organizing committee identified the main contents of the forum as the three most concerned areas: First, the joint innovation of the semiconductor lighting industry chain Relevant policies and measures; Second, in 2013 lighting, video, LED display and LCD screen backlight and other industrial markets, industry development review and 2014 outlook; Third, semiconductor lighting, the newly announced standards interpretation and standard development progress.
The application branch chairman, Guan Jizhen, will present a report on the LED display market, industry overview, and technology trends. Chen Yansheng, vice chairman of the China Lighting Association, will review the development of the lighting industry in 2013 and look forward to the 2014 outlook.
High-level leaders of the leading companies in the industry chain from Liad, Zhongyuan, Zhouming, Huacan, Lianjian, Shilanmingxin, Lehman, Hisense, TCL, Dongshan Precision, Ruifeng, Zhongwei and Yuanrong will The industry's progress over the past year, future technological trends, and reflections on the development of industries in the new situation.
The interpretation of semiconductor lighting standards is an important forum for the previous summit forums, and is an important platform for publicizing and implementing relevant standards. The standard experts will bring everyone's attention to the latest progress in the development of national standards for LED bulbs and straight tube lamps for general illumination and the interpretation of the latest standards concerning the reliability of LED lamps.
It is not difficult to find that this forum will focus on the joint innovation of the industrial chain of LED display screens, LCD backlights, and special equipment. It aims to cooperate with industry authorities to actively explore mechanism innovation while improving technological innovation capabilities. Implementation.

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