White LED has been widely used in mobile phones, LCD TV backlight modules, automotive headlights, taillights, interior lights, street lighting, general lighting, etc., its future development has attracted attention. The LED itself continues to evolve with high luminance, low power consumption, and long life. The demand for LE in the market is becoming stronger and stronger. Therefore, the innovation process of LED manufacturers has become a major issue. Next, we will introduce the laser processing technology for high-efficiency cutting of high-brightness LED sapphire substrates.
development path
In the past, the sapphire wafers of LEDs were mostly singulated by a laser slicer, and then the separation process was forced to be separated. This method must depend on the operator's proficiency in addition to the yield, and the processing speed and processing speed. The operating cost of consumables and other issues, it is generally believed that in terms of productivity and cost, the mass production of high-intensity LED sapphire substrates will inevitably be replaced by laser cutting. The laser-cut sapphire wafer singulation technology is mainly divided into laser trenching and vanishing graining. As shown in Figure 1, the laser channeling processing method mainly concentrates the laser energy, and irradiates a small area to sublimate the solid. In other words, it is processed by laser cauterization, forming a width of 5 to 10 μm on the LED sapphire substrate, and a depth of 15 The ~30μm ditch, and finally use the Braking machine to open.
The laser channeling processing method can suppress the problem of lowering the brightness of the chip through the selection of the best processing method. If compared with the traditional diamond channel processing method, it can maintain the same brightness, and does not need to rely on the operator. Proficiency, so the stability of the yield and the frequency of replacement of consumables can be reduced, thereby effectively reducing operating costs. In addition, with the narrowing of laser trench processing technology, the number of chip samples per wafer is expected to increase significantly in the future. The new generation of laser processing machines, like the cutting saw blades, employs a platform and handling system, while incorporating laser processing technology to form a highly reliable machine.
The laser oscillator can be optimally matched to the workpiece and process, and finally combined with the optical system unit to achieve a processing point optimization wish. The above optical system unit can make the sapphire wafer trench processing process, the thermal influence on the luminescent layer and the light transmittance of the processing trench are suppressed to a minimum, especially the thermal influence of the luminescent layer, which often becomes a decrease in luminance. main reason.
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