[Text / high- tech LED reporter Zhou Jin] Packaging technology continues to mature, new processes continue to emerge, EMC packaging as a new technology in recent years, because of its good performance is favored by many packaging companies.
Compared to the previous two generations of packaging processes led by PPA and ceramic substrates, EMC packaging is a highly integrated form of Molding equipment packaged with modified Epoxy materials and etching technology.
Due to its excellent mechanical properties, bonding and corrosion resistance, the epoxy resin film (EMC) has a small cure shrinkage and thermal expansion coefficient and good dimensional stability. Therefore, the EMC package has good overall processability and comprehensive performance, and can also achieve large Scale production, cost reduction, flexible design, smaller size and easy to cut, in line with the trend of thin, high integration and small volume of LED products.
But like other new technologies, in the initial introduction stage, due to technical, market and cost constraints, only a few LED packaging manufacturers are in trial production.
"For the change of packaging process, packaging equipment manufacturers are more acute, we have seen the opportunity, in order to seize the market opportunities, EMC packaging is being laid out in advance." Zhuo Weihuang, technical director of Huateng Semiconductor said.
In 2013, the high-tech LED conference, on the afternoon of November 25th, the first packaged device, equipment and materials sponsored by Hengrui Zhida, Zhuo Weihuang will give a keynote speech with “EMC Packaging and Testing†to share Huateng Semiconductor. A solution based on EMC testing.
"HuaTeng Semiconductor is also taking the opportunity to lay out in advance. The latest HT-7900 test sorter for EMC packaging has been mass-produced." Zhuo Weihuang said that this device is also the first test in the industry for professional EMC packaging. Sorting machine. "The launch of this device represents Huateng's technical direction and technical strength. Although the EMC packaging process is still immature, it must be a direction for future LED packaging."
Zhuo Weihuang introduced that the innovation of the new equipment in the test method has broken through the traditional side test method, the probe is designed at the bottom, and the bottom test is a new way. “The new solution has improved at least 50% in test accuracy, test results and test accuracy compared to previous generations, and efficiency has increased by 30%.â€
Compared to the previous two generations of packaging processes led by PPA and ceramic substrates, EMC packaging is a highly integrated form of Molding equipment packaged with modified Epoxy materials and etching technology.
Due to its excellent mechanical properties, bonding and corrosion resistance, the epoxy resin film (EMC) has a small cure shrinkage and thermal expansion coefficient and good dimensional stability. Therefore, the EMC package has good overall processability and comprehensive performance, and can also achieve large Scale production, cost reduction, flexible design, smaller size and easy to cut, in line with the trend of thin, high integration and small volume of LED products.
But like other new technologies, in the initial introduction stage, due to technical, market and cost constraints, only a few LED packaging manufacturers are in trial production.
"For the change of packaging process, packaging equipment manufacturers are more acute, we have seen the opportunity, in order to seize the market opportunities, EMC packaging is being laid out in advance." Zhuo Weihuang, technical director of Huateng Semiconductor said.
In 2013, the high-tech LED conference, on the afternoon of November 25th, the first packaged device, equipment and materials sponsored by Hengrui Zhida, Zhuo Weihuang will give a keynote speech with “EMC Packaging and Testing†to share Huateng Semiconductor. A solution based on EMC testing.
"HuaTeng Semiconductor is also taking the opportunity to lay out in advance. The latest HT-7900 test sorter for EMC packaging has been mass-produced." Zhuo Weihuang said that this device is also the first test in the industry for professional EMC packaging. Sorting machine. "The launch of this device represents Huateng's technical direction and technical strength. Although the EMC packaging process is still immature, it must be a direction for future LED packaging."
Zhuo Weihuang introduced that the innovation of the new equipment in the test method has broken through the traditional side test method, the probe is designed at the bottom, and the bottom test is a new way. “The new solution has improved at least 50% in test accuracy, test results and test accuracy compared to previous generations, and efficiency has increased by 30%.â€
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